Biasing configurations may be bias stress (static or pulsed) or operating stress (dynamic). Depending upon the biasing configuration, supply and input voltages may be grounded or raised to a maximum potential chosen to ensure a stressing temperature not higher than the maximum-rated junction temperature. Device outputs may be unloaded or loaded, to achieve the specified output voltage level. If a device has a thermal shutdown feature it shall not be biased in a manner that could cause the device to go into thermal shutdown.